And more particularly Sn-Ag-Cu-Ni-Al-based lead-free solder alloy in the technical field of manufacturing electronic and electronic materials. % By weight of each chemical component of the solder alloy is Ag 1.5~4.0, Cu 0.1~2.0, Al 0.001~0.5, Ni: 0.01~1.0, Sn rest It is inevitable impurities and. Is possible by making the conventional method, to obtain various physical shapes, such as lines paste, powder, block, bar or reflow soldering, wave soldering, lead-free solder alloys of the present invention, such as manual soldering with It is intended to satisfy the demand of many by welding a wide variety of methods. Removing the oxide film using a solvent when performing increasing the spreading rate of 1) solder alloy, and 2) welding, to enhance the bond strength of the welds, and homogenized tissue, the present invention solder alloy can reduce defects and a feature to increase the stability of the oxidation resistance is good, 3) solder alloy, and prevent deterioration of the weld characteristics of the solder.
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