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REFRACTORY METAL-DOPED SPUTTERING TARGETS, THIN FILMS PREPARED THEREWITH AND ELECTRONIC DEVICE ELEMENTS CONTAINING SUCH FILMS
REFRACTORY METAL-DOPED SPUTTERING TARGETS, THIN FILMS PREPARED THEREWITH AND ELECTRONIC DEVICE ELEMENTS CONTAINING SUCH FILMS
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机译:掺有金属的难熔溅射靶,因此准备了薄薄膜和包含这种薄膜的电子设备元件
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摘要
Metallic materials consisting essentially of a conductive metal matrix, preferably copper, and a refractory dopant component selected from the group consisting of tantalum, chromium, rhodium, ruthenium, iridium, osmium, platinum, rhenium, niobium, hafnium and mixtures thereof, preferably in an amount of about 0.1 to 6% by weight based on the metallic material, alloys of such materials, sputtering targets containing the same, methods of making such targets, their use in forming thin films and electronic components containing such thin films.
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