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Sputtering target, method for producing same, sputtering thin film formed by using such sputtering target, and organic EL device using such thin film

机译:溅射靶,其制造方法,通过使用该溅射靶形成的溅射薄膜以及使用该薄膜的有机EL装置

摘要

Provided is a sputtering target which can give a high water barrier property and a high flexibility to a sputtering film, can keep a high film forming rate certainly in sputtering, and can make damages to an objective substance wherein a film is to be formed as small as possible. In order to realize this, a mixed powder which contains 20 to 80% by weight of a SiO powder, the balance of the powder being made of a TiO2 powder and/or a Ti powder, is pressed and sintered. The sintered body has a composition of SiαTiβOγ wherein α, β and γ are mole ratios of Si, Ti and O, respectively, and the ratio of α/β ranges from 0.45 to 7.25 and the ratio of γ/(α+β) ranges from 0.80 to 1.70.
机译:本发明提供一种溅射靶,其可以赋予溅射膜高的阻水性和高的挠性,并且可以在溅射时确实地保持高的成膜速度,并且可以损害要形成膜的目标物质。尽可能。为了实现这一点,压制包含20-80重量%的SiO粉末的混合粉末,该粉末的其余部分由TiO 2粉末和/或Ti粉末制成。并烧结。该烧结体具有SiαTiβOγ的组成,其中α,β和γ分别为Si,Ti和O的摩尔比,并且α/β的比率在0.45至7.25的范围内,并且γ/(α+β)的比率在从0.80到1.70。

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