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Sputtering target, method for producing same, sputtering thin film formed by using such sputtering target, and organic EL device using such thin film
Sputtering target, method for producing same, sputtering thin film formed by using such sputtering target, and organic EL device using such thin film
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机译:溅射靶,其制造方法,通过使用该溅射靶形成的溅射薄膜以及使用该薄膜的有机EL装置
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摘要
Provided is a sputtering target which can give a high water barrier property and a high flexibility to a sputtering film, can keep a high film forming rate certainly in sputtering, and can make damages to an objective substance wherein a film is to be formed as small as possible. In order to realize this, a mixed powder which contains 20 to 80% by weight of a SiO powder, the balance of the powder being made of a TiO2 powder and/or a Ti powder, is pressed and sintered. The sintered body has a composition of SiαTiβOγ wherein α, β and γ are mole ratios of Si, Ti and O, respectively, and the ratio of α/β ranges from 0.45 to 7.25 and the ratio of γ/(α+β) ranges from 0.80 to 1.70.
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