LED packaging structure with aluminum board and an LED lamp with said LED packaging structure

摘要

An LED lamp is provided. The LED lamp has an aluminum board, a semiconductor substrate, at least a LED chip, a metal layer structure, and heat sink. The aluminum board has a cup structure thereon. The semiconductor substrate is assembled on a bottom surface of the cup structure. The LED chips are assembled on the semiconductor substrate. The metal layer structure is formed on a bottom surface of the aluminum board. The metal layer structure is composed of solderable materials. The heat sink is connected to the metal layer structure through solder joint.