TECHNOLOGY FOR MANUFACTURING LED FACTORY LAMP BY COMBINING HIGH BRIGHTNESS INTEGRATED LED WATERPROOF PACKAGE DEVICE WITH ALUMINUM HEAT SINK LAMP CASE OF INTEGRATED STRUCTURE

摘要

The present invention relates to a factory lamp using a high bright and high output LED element integrated with a die chip, and more particularly to a factory lamp which includes an illumination module for emitting light, a support plate for supporting the illumination module, and a heat sink part including a plurality of heat radiation fins around the support plate. The illumination module forms a block on which the LED die chip is to be mounted on the first PCB substrate. After Ag is coated on the opposite side of the first PCB substrate on which the LED die chip is to be mounted, the first PCB substrate is compressed and combined with a second PCB substrate. After conductive pads made of copper (Cu) materials are alternatively formed on both sides of left and right sides of the surface of the first PCB substrate, graphene is sprayed into the block. After the LED die chip is arranged on the upper side of the graphene, the LED die chip is cured. At least one element connected in parallel with the conductive pads of both sides of the LED die chip through two wires respectively is formed. A diffusion cover is mounted on the support plate formed with an arc shape to diffuse the light from the LED, thereby widening a working range in a factory. Accordingly, the present invention can increase the life of the illumination module and obtain high heat dissipation properties.;COPYRIGHT KIPO 2017