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Process for manufacturing an LED lamp with integrated heat sink

机译:具有集成散热器的LED灯的制造方法

摘要

A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by a conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway.
机译:一种用于制造LED灯组件的方法,其包括对诸如铝或铝合金基体之类的导电且导热的基体的至少一部分表面进行阳极氧化,以形成电绝缘涂层。基座可以形成散热器或耦合至散热器。电路走线形成在底座的阳极氧化表面上,包括LED接点。 LED通过导电的金属焊料被电气和机械地附着到LED平台,从而从LED产生的热量通过焊料有效地传递,并且电路迹线LED平台通过金属与金属的接触路径传递到基座和散热器。

著录项

  • 公开/公告号US7676915B2

    专利类型

  • 公开/公告日2010-03-16

    原文格式PDF

  • 申请/专利权人 ARTAK TER-HOVHANNISSIAN;

    申请/专利号US20050162783

  • 发明设计人 ARTAK TER-HOVHANNISSIAN;

    申请日2005-09-22

  • 分类号H05K3/34;

  • 国家 US

  • 入库时间 2022-08-21 18:51:19

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