The light-emitting diode lamp which possesses light-emitting diode (LED) package structure and this package structure which use the aluminum substrate

摘要

Topic The light-emitting diode lamp which can improve luminous efficiency and heat dissipation efficiency is offered.SolutionsThe aluminum substrate and the cushioning substrate, at least one light-emitting diode tip/chip, metal layer system and the light-emitting diode lamp which possesses the cooling wheel. Among those, the concave cup is provided on the aluminum substrate. The cushioning substrate is installed in the base of this concave cup. The light-emitting diode tip/chip is installed on the cushioning substrate. Metal layer system is formed to the surface under the aluminum substrate. This metal layer system is formed by the soldered possible material. The cooling wheel through solder material formation, is jointed to this metal layer system. Choice figure Drawing 2