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LED packaging structure with aluminum board and an LED lamp with said LED packaging structure
LED packaging structure with aluminum board and an LED lamp with said LED packaging structure
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机译:具有铝板的led封装结构和具有该led封装结构的led灯
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摘要
An LED lamp is provided. The LED lamp has an aluminum board, a buffer substrate, at least a LED chip, a metal layer structure, and heat sink. The aluminum board has a cup structure thereon. The buffer substrate is assembled on a bottom surface of the cup structure. The LED chips are assembled on the buffer substrate. The metal layer structure is formed on a bottom surface of the aluminum board. The metal layer structure is composed of solderable materials. The heat sink is connected to the metal layer structure through solder joint.
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