SEMICONDUCTOR ASSEMBLY FOR IMPROVED DEVICE WARPAGE AND SOLDER BALL COPLANARITY

摘要

A semiconductor device with a chip (505), its position defining a plane, and an insulating substrate (503) with first and second surfaces, the substrate is substantially coplanar with the chip, without warpage. One of the chip sides is attached to the first substrate surface using adhesive matepal (504), which has a thickness. The thickness of the adhesive matepal is distnbuted so that the thickness (504b) under the central chip area is equal to or smaller than the matenal thickness (504a) under the peripheral chip areas. Encapsulation compound (701 ) is embedding all remaining chip sides and the portions of the first substrate surface, which are not involved in the chip attachment. When reflow elements (720) are attached to the substrate contact pads, they are substantially coplanar with the chip.