ETCHING ISOLATION OF LPCC/QFN STRIP

摘要

Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages which utilize carriers in strip format are provided, wherein the leads (or terminals)(210a, 210b) are formed to be electrically isolated from one another within each unit and in which the units are formed to be electrically isolated from one another within the strip (100) using chemical etching techniques.