首页> 外文OA文献 >ELECTROLYSIS OF COPPER FORM STRIPPING SOLUTIONS FOR ETCHING PRINTED CIRCUIT BOARDS

【2h】

ELECTROLYSIS OF COPPER FORM STRIPPING SOLUTIONS FOR ETCHING PRINTED CIRCUIT BOARDS

机译：用于蚀刻印刷电路板的铜形剥离溶液的电解

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
E.S. Kondratieva; A.F. Gubin; V.A. Brodsky; V.A. Kolesnikov; M. Zhurinov; A.R. Brodskiy;
展开▼
作者单位

展开▼
年度 2019
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Theoretical and Practical Basis of the Regeneration and Disposal of Sulfuric Copper Etching Solutions Used in the Production of Printed Circuit Boards by Membrane and Membraneless Electrolysis [J] . Turaev D. Yu., Kolesnikov V. A., Popov A. N. Theoretical foundations of chemical engineering . 2021,第1期

机译：通过膜和膜电解生产的印刷电路板生产的硫酸铜蚀刻溶液的重新组制和处理的理论和实际基础
2. Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution [J] . Man-Seung Lee, Jong-Gwan Ahn, Jae-Woo Ahn Hydrometallurgy . 2003,第1a3期

机译：从印刷电路板的废硝酸腐蚀液中回收铜，锡和铅，并再生腐蚀液
3. Ultrasonic recovery of copper and iron through the simultaneous utilization of Printed Circuit Boards (PCB) spent acid etching solution and PCB waste sludge☆ [J] . Zhiyuan Huang, FengchunXie, YangMa Journal of Hazardous Materials . 2011,第1期

机译：通过同时利用印刷电路板（PCB）废酸蚀刻液和PCB废渣对铜和铁进行超声波回收☆
4. Characteristics of Wet Etching of Copper Foil for Printed Circuit Boards by using Ferric Chloride Solution [C] . Katsutoshi Matsumoto, Shingo Funahashi, Shoji Taniguchi Microelectronics . 2003

机译：氯化铁溶液对印刷电路板铜箔的湿蚀特性
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms [O] . Philipp Nothdurft, Gisbert Riess, Wolfgang Kern 2019

机译：印刷电路板中的铜/环氧树脂接头：制造和界面破坏机制
7. Electroless copper plating by applying electrolysis. Application for a printed circuit board manufacturing process. [O] . Hideo HONMA, Tomoyuki FUJINAMI, Hiroaki TAKAGI 1990

机译：施加电解镀铜电镀。应用于印刷电路板制造过程。

ELECTROLYSIS OF COPPER FORM STRIPPING SOLUTIONS FOR ETCHING PRINTED CIRCUIT BOARDS

著录项

引文网络

相似文献

相关主题

期刊订阅