TEMPLATE FOR FORMING SOLDER BUMPS, METHOD OF MANUFACTURING THE TEMPLATE AND METHOD OF INSPECTING SOLDER BUMPS USING THE TEMPLATE

摘要

A template for forming solder bumps includes a transparent substrate on which a plurality of cavities is formed at surface portions thereof, and an opaque layer formed on the transparent substrate and having a plurality of openings to expose the cavities. Thus, the transparent substrate is prevented from being damaged by a nozzle for injecting a molten solder while injecting the molten solder in the cavities and the openings. The solder bumps formed in the cavities and the openings may be inspected by analyzing light transmitted through edge portions of the cavities.