TEMPLATE FOR FORMING SOLDER BUMPS, METHOD OF MANUFACTURING THE TEMPLATE AND METHOD OF INSPECTING SOLDER BUMPS USING THE TEMPLATE

摘要

A template for forming solder bumps, a method for manufacturing the same, and a method for inspecting solder bumps by using the same are provided, which suppress the damage of template even in case of being contacted with the nozzle. A plurality of cavities(22a) are formed in the upper part of the transparent substrate(22). The light reflector film(24) is formed on the lower surface of the transparent substrate. The light reflector film includes metal. The protective film(26) is formed on the light reflector film. A plurality of cavities for partly removing upper part of the transparent substrate and forming solder bumps are formed. The step that the protective film is formed on the light reflector film is included.