TEMPLATE FOR FORMING SOLDER BUMPS, METHOD OF MANUFACTURING THE TEMPLATE AND METHOD OF INSPECTING SOLDER BUMPS USING THE TEMPLATE

摘要

A template for forming solder bumps, a method for manufacturing the same, and a method for inspecting solder bumps by using the same are provided, which improve test process about the solder bump. In the transparent substrate(22) surface area, a plurality of cavities(22a) are formed. A plurality of openings(24a) expose cavities while being formed on the transparent substrate. The opaque film(24) is selected from the group consisting of metal, and metal-nitride and silicon nitride. The ratio of the thickness of cavity and the depth of the opaque film is 1:0.1-0.5. The opaque film is formed on the transparent substrate. The opaque film is partly removed and the surface areas of the transparent substrate are exposed. The surface areas of the exposed transparent substrate are removed and a plurality of cavities are formed.