METHOD FOR MANUFACTURING OF MULTILAYER PRINTED CIRCUIT BORD

摘要

A method for manufacturing of multilayer printed circuit board is provided to reduce the number of process and manufacturing cost without formation and copper electroplating hole with a mechanics or laser drill. A method for manufacturing of multilayer printed circuit board is comprised of the steps: forming the conductor bump on the fixed position of one page of the first copper foil(S10); penetrating the insulating layer which is the free plug-in(S20); laminating a first copper foil in which bump is formed by using the second copper foil is used for the upper dielectric layer(S30); performing circuit patterning to corresponded to the circuit design(S40).