RESIN COMPOSITION FOR USE IN FORMATION OF BONDING LAYER IN MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD RESIN VARNISH RESIN-COATED COPPER FOIL MANUFACTURING METHOD FOR RESIN-COATED COPPER FOIL FOR USE IN MANUFACTURING OF MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD

摘要

It is an object of the present invention to provide a resin composition capable of preventing so-called B-stage cracking and preventing the powder from dropping during the manufacturing process of a flexible printed wiring board, as well as achieving balanced performance in terms of bending resistance, heat resistance and resin flow The purpose. In order to solve the above problems, a resin composition for forming an adhesive layer for multilayering an inner layer flexible printed wiring board is provided. The component A is a solid, high heat resistant epoxy resin having a softening point of 50 DEG C or higher, a component B: , Phenol aralkyl type phenol resin, component C: a rubber-modified polyamideimide resin soluble in a solvent having a boiling point in the range of 50 占 폚 to 200 占 폚 Component D: organic phosphorus ( organic phosphorus-containing flame retardant, and component E: a biphenyl-type epoxy resin.