PROBLEM TO BE SOLVED: To provide a wiring board having an excellent adhesion strength between an inter-layer insulation layer constituting a build-up layer and a ceramic chip for embedment.;SOLUTION: A wiring board 10 comprises a board core 11, a ceramic chip 101 for embedment, and a build-up layer 31. The board core 11 has an accommodation hole 91 that opens on a core main surface 12. The ceramic chip 101 for embedment has a plurality of terminal electrodes 111 and 112 consisting of metalized layers 116 that project on a chip main surface 102. Note that occupied areas of the plurality of terminal electrodes 111 and 112 that exist on the chip main surface 102 is about 68% of an area of the chip main surface 102. The ceramic chip 101 for embedment is accommodated in the accommodation hole 91, with the core main surface 12 and the chip main surface 102 directed to the same side. The build-up layer 31 is formed on the core main surface 12 and the chip main surface 102.;COPYRIGHT: (C)2007,JPO&INPIT
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