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Methods of manufacturing a semiconductor device including CMOS transistor having different PMOS and NMOS gate electrode structures

机译:制造包括具有不同的PMOS和NMOS栅电极结构的CMOS晶体管的半导体器件的方法

摘要

In a method of manufacturing a semiconductor device, a gate insulation layer is formed on a substrate including a first channel of a first conductive type and a second channel of a second conductive type different from the first conductive type. A first conductive layer including a first metal is formed on the gate insulation layer, and a second conductive layer including a second metal different from the first metal is formed on the first conductive layer formed over the second channel. The second conductive layer is partially removed by a wet etching process to form a second conductive layer pattern over the second channel.
机译:在制造半导体器件的方法中,在包括第一导电类型的第一沟道和不同于第一导电类型的第二导电类型的第二沟道的衬底上形成栅绝缘层。在栅极绝缘层上形成包括第一金属的第一导电层,并且在形成在第二沟道上方的第一导电层上形成包括与第一金属不同的第二金属的第二导电层。通过湿蚀刻工艺部分地去除第二导电层,以在第二沟道上方形成第二导电层图案。

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