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THIN FILM SEMICONDUCTOR ALLOY MATERIAL PREPARED BY A VHF ENERGIZED PLASMA DEPOSITION PROCESS

机译:VHF激发等离子体沉积工艺制备的薄膜半导体合金材料

摘要

A thin film, hydrogenated, silicon based semiconductor alloy material is produced by a VHF energized plasma deposition process wherein a process gas is decomposed in a plasma so as to deposit the thin film material onto a substrate. The process is carried out at process gas pressures which are in the range of 0.5-2.0 torr, with substrate temperatures that do not exceed 300° C, and substrate-cathode spacings in the range of 10-50 millimeters. Deposition rates are at least 5 angstroms per second. Also disclosed are photovoltaic devices which include the semiconductor material.
机译:薄膜氢化的硅基半导体合金材料是通过VHF激发等离子体沉积工艺生产的,其中将处理气体在等离子体中分解,以将薄膜材料沉积到基板上。该过程在0.5-2.0托的过程气压下进行,衬底温度不超过300℃,衬底-阴极间距在10-50毫米范围内。沉积速率至少为每秒5埃。还公开了包括半导体材料的光伏器件。

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