SURFACE MOUNTING METHOD FOR COMPONENT TO BE MOUNTED, STRUCTURE WITH MOUNTED COMPONENT OBTAINED BY THE METHOD, AND LIQUID EPOXY RESIN COMPOSITION FOR UNDERFILL USED IN THE METHOD

摘要

Disclosed is a surface mounting method which comprises: a coating step wherein a liquid curable resin composition for an underfill is applied over either a mounting electrode formation surface and/or a bump electrode formation surface, on which either the mounting electrode or the bump electrode is formed from a solder, so as not to cover the electrode(s); a mounting step wherein a component to be surface-mounted is mounted on a circuit board in such a manner that the bump electrode and the mounting electrode face each other, said mounting step being performed after the coating step; and a reflow step wherein the circuit board on which the component has been surface-mounted is subjected to a reflow process, so that the solder is melted and the liquid curable resin composition is cured. The surface mounting method is characterized in that the gelation time of the liquid curable resin composition at the melting point of the solder is within the range of 35-75 seconds.