首页> 外国专利> LIQUID EPOXY RESIN COMPOSITION FOR UNDERFILL, STRUCTURE WITH MOUNTED COMPONENT USING THE SAME AND SURFACE MOUNTING METHOD OF MOUNTED COMPONENT

LIQUID EPOXY RESIN COMPOSITION FOR UNDERFILL, STRUCTURE WITH MOUNTED COMPONENT USING THE SAME AND SURFACE MOUNTING METHOD OF MOUNTED COMPONENT

机译:用于装填的液态环氧树脂组合物,采用相同成分的固定组件结构和固定组件的表面安装方法

摘要

PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for underfill which prevents a void from remaining in a cured underfill resin, can form an underfill without inhibiting a self alignment action, and is used for simultaneous reflow and curing method.;SOLUTION: There is provided a liquid epoxy resin composition for underfill which contains an epoxy resin, a phenol resin curing agent, and a microencapsulated potential curing accelerator.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种用于底部填充剂的液态环氧树脂组合物,该组合物可防止在固化的底部填充剂树脂中残留空隙,可形成底部填充剂而不会抑制自对准作用,并用于同时回流和固化方法。提供了一种用于底部填充的液体环氧树脂组合物,其包含环氧树脂,酚醛树脂固化剂和微囊化的潜在固化促进剂。;版权所有:(C)2015,JPO&INPIT

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