SURFACE MOUNTING METHOD FOR COMPONENT TO BE MOUNTED, STRUCTURE WITH MOUNTED COMPONENT OBTAINED BY THE METHOD, AND LIQUID EPOXY RESIN COMPOSITION FOR UNDERFILL USED IN THE METHOD

摘要

PPROBLEM TO BE SOLVED: To provide a surface mounting method which can perform the formation of an underfill, while preventing voids from remaining in the hardened underfill resin, without impeding self-alignment action. PSOLUTION: The surface mounting method is provided with: an application step of applying a liquid hardening resin composition 3 for the under fill to at least any one of the surface, in which a mounting electrode is formed and the surface, in which a bump electrode is formed not so as to cover the electrode, wherein either of the bump electrode 5 or the mounting electrode 1 is formed with solder; a mount step of mounting a surface mount component 4, in a circuit substrate 2 so that the bump electrode and the mounting electrode are opposed to each other, after the application step; and a reflow step of performing a reflow process for the circuit substrate, in which the surface mount device is mounted, to make the solder melt and make the liquid hardening resin composition harden, wherein the gelation time in the melting point of the solder of the liquid-hardening resin composition is in the range of 35 to 75 seconds. PCOPYRIGHT: (C)2010,JPO&INPIT