SUBSTRATE ASSEMBLY OF AN ELECTRONIC DEVICE, CAPABLE OF REDUCING THE SIZE AND THE LOSS OF A SUBSTRATE BY DIVIDING THE SET SUBSTRATE BUILT IN THE ELECTRONIC DEVICE INTO A PLURALITY OF SUBSTRATES

摘要

PURPOSE: A substrate assembly of an electronic device is provided to prevent the damage to a substrate due to the friction between wires by insulating a plurality of substrates through an insulator.;CONSTITUTION: A substrate assembly of an electronic device comprises a plurality of power substrates(50,60). Each power substrate comprises electric parts. The electric parts with different electric specification are installed at the substrates, respectively. At the substrates, MICOMs(51,61) are respectively formed. The MICOMs interlink the substrates in a serial communication. An insulator is formed between the substrates. The insulator connects the substrates in an insulating state.;COPYRIGHT KIPO 2010