首页> 外国专利> SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WHICH IS FORMED BY USING A PRINTING METHOD, CAPABLE OF IMPROVING RELIABILITY, AND A MANUFACTURING METHOD THEREOF

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WHICH IS FORMED BY USING A PRINTING METHOD, CAPABLE OF IMPROVING RELIABILITY, AND A MANUFACTURING METHOD THEREOF

机译:采用印刷方法,能够提高可靠性的半导体集成电路装置及其制造方法

摘要

PURPOSE: A semiconductor integrated circuit device and a manufacturing method thereof are provided to form a source/drain region which is formed in both side walls of a nano semiconductor type material.;CONSTITUTION: A semiconductor integrated circuit device includes a gate(210), a gate insulating layer(220), a nano semiconductor type material(230), and a source/drain region(250). The gate is formed on a substrate. The gate insulating layer is formed on the gate. The nano semiconductor type material is formed in the partial region on the gate insulating layer. The source/drain region is formed on the side wall of the nano semiconductor type material and is separated with the nano semiconductor type material.;COPYRIGHT KIPO 2011
机译:目的:提供一种半导体集成电路器件及其制造方法,以形成源/漏区,该源/漏区形成在纳米半导体类型材料的两个侧壁中。;构成:一种半导体集成电路器件,包括栅极(210),栅极绝缘层(220),纳米半导体型材料(230)和源/漏区(250)。栅极形成在基板上。栅极绝缘层形成在栅极上。纳米半导体型材料形成在栅极绝缘层上的部分区域中。源/漏区形成在纳米半导体型材料的侧壁上,并与纳米半导体型材料分隔开。; COPYRIGHT KIPO 2011

著录项

  • 公开/公告号KR20100102946A

    专利类型

  • 公开/公告日2010-09-27

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20090021276

  • 发明设计人 JEON SANG HUN;LEE MOON SOOK;

    申请日2009-03-12

  • 分类号H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:52

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