SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF THE SEMICONDUCTOR INTEGRATED CIRCUIT, CAPABLE OF FORMING ON A GLASS SUBSTRATE AND A FLEXIBLE SUBSTRATE

摘要

PURPOSE: A semiconductor integrated circuit, semiconductor device, and manufacturing method of the semiconductor integrated circuit are provided to reduce production costs by using a glass substrate instead of a silicon substrate. ;CONSTITUTION: In a semiconductor integrated circuit, semiconductor device, and manufacturing method of the semiconductor integrated circuit, an insulating substrate includes a connection terminal. A memory cell is formed on an insulating substrate and is connected to a wire including a cut portion which is obtained in laser cutting. An antenna(102) is connected to the connection terminal is formed on the semiconductor integrated circuit.;COPYRIGHT KIPO 2011