CONDUCTIVE JUNCTION MATERIAL, CAPABLE OF IMPROVING A HEAT RADIATING PROPERTY AND A JUNCTION RELIABILITY, A JUNCTION METHOD, AND A SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A conductive junction material, a junction method, and a semiconductor device using the same are provided to secure the high heat resistant property and the high heat radiating property of a junction part by performing a pressureless junction process without an adhesive.;CONSTITUTION: A conductive junction material is arranged between junction units(201). The conductive junction material includes a silver oxide particle(202), silver flake(203), and a dispersing agent. The dispersing agent includes an organic compound with 30 or less carbon numbers. The conductive junction material is heated to be sintered in order to form a sintered silver layer(205). The sintered silver layer is bonded with the junction interface of the junction units by a metallic bond.;COPYRIGHT KIPO 2011