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Vapor phase growth apparatus and method of growing AlN epitaxial layer

机译:气相生长设备和生长AlN外延层的方法

摘要

PROBLEM TO BE SOLVED: To provide an AlN epitaxial growth method which can grow a high-quality AlN crystal on a sapphire substrate or a Si substrate at a high rate.;SOLUTION: HCl and H2 are introduced through a first gas introduction port 12, and an Al metal reacts with HCl at 750°C or lower to form AlCl3. NH3 and H2 are introduced through a second gas introduction port 14, and NH3 and AlCl3 are mixed in a mixing portion. The mixed gas is transferred to a substrate so that it reacts to form AlN. The temperature of the mixing portion is kept in a range of 80°C to 750°C in which AlCl3 formed in a material reaction portion is not deposited in a quartz reaction chamber 18 and AlN is not deposited in the mixing portion. A substrate crystal 24 is kept at a temperature of 900°C to 1,700°C by high-frequency heating. This prevents AlN from being deposited before reaching the substrate crystal 24, thereby increasing the AlN epitaxial growth rate.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种AlN外延生长方法,该方法可以在蓝宝石衬底或Si衬底上以高速率生长高质量的AlN晶体。解决方案:引入了HCl和H 2 通过第一气体引入口12,铝金属与750℃或更低的HCl反应形成AlCl 3 。 NH 3 和H 2 通过第二气体引入口14引入,NH 3 和AlCl 3 在混合部分混合。混合气体被转移到衬底上,使其反应形成AlN。混合部分的温度保持在80℃至750℃的范围内,其中在材料反应部分中形成的AlCl 3 不沉积在石英反应室18中并且AlN不沉积。在混合部分。通过高频加热将衬底晶体24保持在900℃至1,700℃的温度下。这防止了AlN在到达衬底晶体24之前沉积,从而提高了AlN外延生长速率。;版权所有:(C)2005,JPO&NCIPI

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