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Non-volatile resistive oxide memory cells, non-volatile resistive oxide memory arrays, and methods of forming non-volatile resistive oxide memory cells and memory arrays

机译:非易失性电阻氧化物存储单元,非易失性电阻氧化物存储阵列以及形成非易失性电阻氧化物存储单元和存储阵列的方法

摘要

A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. Insulative material is deposited over the first electrode. An opening is formed into the insulative material over the first electrode. The opening includes sidewalls and a base. The opening sidewalls and base are lined with a multi-resistive state layer comprising multi-resistive state metal oxide-comprising material which less than fills the opening. A second conductive electrode of the memory cell is formed within the opening laterally inward of the multi-resistive state layer lining the sidewalls and elevationally over the multi-resistive state layer lining the base. Other aspects and implementations are contemplated.
机译:形成非易失性电阻氧化物存储单元的方法包括形成存储单元的第一导电电极作为衬底的一部分。绝缘材料沉积在第一电极上。在第一电极上方的绝缘材料中形成开口。开口包括侧壁和基底。开口侧壁和基部衬有多电阻态层,该多电阻态层包括少于填充开口的包含多电阻态金属氧化物的材料。存储单元的第二导电电极形成在衬在侧壁上的多电阻状态层的横向内侧的开口内并且在衬在基底上的多电阻状态层的上方垂直地形成。可以预期其他方面和实施方式。

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