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OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
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机译:克服芯片封装中的层状翘曲和误动
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摘要
An apparatus, system, and method are disclosed for connecting an integrated circuit device to a substrate. A plurality of standard diameter pillars and three or more increased diameter pillars are disposed on an integrated circuit device. The increased diameter pillars have a diameter that is greater than the standard diameter pillars and a height that is similar to the standard diameter pillars. The standard diameter pillars and the increased diameter pillars form a pattern on the integrated circuit device that corresponds to contact pads on a substrate opposite the integrated circuit device. A first group of solder bumps is disposed between the standard diameter pillars and the contact pads. A second group of solder bumps is disposed between the increased diameter pillars and the contact pads. The second group of solder bumps has pre-connection heights that are greater than pre-connection heights of the first group of solder bumps.
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