FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, CAPABLE OF DISPLAYING EXCELLENT HOLDING FORCE IN THE DICING PROCESS OF A SEMICONDUCTOR WAFER

摘要

PURPOSE: A film for flip chip type semiconductor back surface is provided to implement excellent laser marking and appearance after bonding the flip chip of a semiconductor chip. ;CONSTITUTION: In a film for flip chip type semiconductor back surface, a film(2) for the flip chip type semiconductor backside is formed in the backside of the semiconductor device. The film comprises a laser marking layer(21) and a wafer adhesive layer(22). A dicing tape(3) comprises a material(31) and an adhesive layer(32) which are formed on the materials. The surface of the wafer adhesion layer is protected from a separator until being attached to the backside of wafer.;COPYRIGHT KIPO 2011