FLIP CHIP TYPE SEMICONDUCTOR REAR SURFACE FILM FOR EFFECTIVELY SUPPRESSING BENDING OF A SEMICONDUCTOR DEVICE BEFORE PERFORMING A REFLOW PROCESS, A DICING TAPE INTEGRATED TYPE SEMICONDUCTOR REAR SURFACE FILM, A MANUFACTURING METHOD OF A SEMICONDUCTOR APPARATUS, AND A FLIP CHIP TYPE SEMICONDUCTOR APPARATUS

摘要

PURPOSE: A flip chip type semiconductor rear surface film, a dicing tape integrated type semiconductor rear surface film, a manufacturing method of a semiconductor apparatus, and a flip chip type semiconductor apparatus are provided to protect the rear surface of a semiconductor device using the semiconductor rear surface film, thereby preventing bending or damage of a semiconductor device.;CONSTITUTION: A dicing tape(3) comprises an adhesive layer(32) arranged on a base material(31). A flip chip type semiconductor rear surface film(2) is arranged on the adhesive layer. The flip chip type semiconductor rear surface film has a film shape. The flip chip type semiconductor rear surface film is arranged only on a region(33) corresponding to a semiconductor wafer attached region. The surface of the semiconductor rear surface film is protected by a separator until the rear surface of a wafer is attached on the surface of the semiconductor rear surface film.;COPYRIGHT KIPO 2012