FLIP CHIP TYPE SEMICONDUCTOR REAR SURFACE FILM CAPABLE OF PREVENTING BENDING OF A SEMICONDUCTOR DEVICE, A DICING TAPE INTEGRATED TYPE SEMICONDUCTOR REAR SURFACE FILM, A MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE, AND A FLIP CHIP TYPE SEMICONDUCTOR APPARATUS

摘要

PURPOSE: A flip chip type semiconductor rear surface film, a dicing tape integrated type semiconductor rear surface film, a manufacturing method of the semiconductor device, and a flip chip type semiconductor apparatus are provided to omit a semiconductor rear surface film attaching process by arranging a dicing tape and a flip chip type semiconductor rear surface film into one body.;CONSTITUTION: A dicing tape(3) comprises an adhesive layer(32) arranged on a base material(31). A semiconductor rear surface film(2) is arranged on the adhesive layer. A semiconductor rear surface film has a film shape. Various kinds of information such as graph information, letter information, or etc. are recorded on the semiconductor rear surface film by a laser marking process. The semiconductor rear surface film is comprised of a resin composition which includes thermoplastic resin and thermosetting resin.;COPYRIGHT KIPO 2012