MANUFACTURING METHOD FOR RETAINNER RING OF CHEMICAL MECHANICAL POLISHING APPARATUS AND THE RETAINNER RING

摘要

The present invention relates to a method of manufacturing a retainer ring of a chemical mechanical polishing apparatus and a retainer ring of a chemical mechanical polishing apparatus, wherein a plurality of side holes are formed in an outer shell member surrounding the insertion ring member, and the insertion ring member is not exposed from the side holes. Not to form the shell member. The present invention has the effect of smoothly removing the chemical abrasive in the polishing head to prevent problems caused by the chemical abrasive remaining in the polishing head. The present invention has the effect of improving the polishing operation efficiency of the semiconductor wafer and enabling a stable polishing operation.