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RETAINING RING FOR CHEMICAL MECHANICAL POLISHING PROCESS, METHOD FOR THE MANUFACTURE THEREOF, AND CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE RETAINING RING
RETAINING RING FOR CHEMICAL MECHANICAL POLISHING PROCESS, METHOD FOR THE MANUFACTURE THEREOF, AND CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE RETAINING RING
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机译:化学机械抛光过程的保持环,其制造方法以及包括该保持环的化学机械抛光系统
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摘要
A retaining ring for use in a chemical mechanical polishing process includes an annular metal backbone, a lower portion, and an upper portion. The lower portion has a bottom surface for contacting a polishing pad during the chemical manufacturing polishing process where the lower portion includes a poly(etherimide), or a combination of a poly(etherimide) and a poly(aromatic ketone). The upper portion includes a thermoplastic polymer. The annular metal backbone is positioned between the lower portion and the upper portion. Methods for the manufacture of the retaining ring are also described.
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