首页> 外国专利> RETAINING RING FOR CHEMICAL MECHANICAL POLISHING PROCESS, METHOD FOR THE MANUFACTURE THEREOF, AND CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE RETAINING RING

RETAINING RING FOR CHEMICAL MECHANICAL POLISHING PROCESS, METHOD FOR THE MANUFACTURE THEREOF, AND CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE RETAINING RING

机译:化学机械抛光过程的保持环,其制造方法以及包括该保持环的化学机械抛光系统

摘要

A retaining ring for use in a chemical mechanical polishing process includes an annular metal backbone, a lower portion, and an upper portion. The lower portion has a bottom surface for contacting a polishing pad during the chemical manufacturing polishing process where the lower portion includes a poly(etherimide), or a combination of a poly(etherimide) and a poly(aromatic ketone). The upper portion includes a thermoplastic polymer. The annular metal backbone is positioned between the lower portion and the upper portion. Methods for the manufacture of the retaining ring are also described.
机译:用于化学机械抛光过程的保持环包括环形金属骨架,下部和上部。下部具有用于在化学制造抛光过程中接触抛光垫的底表面,其中下部包括聚(醚酰亚胺)或聚(醚酰亚胺)和聚(芳族酮)的组合。上部包括热塑性聚合物。环形金属骨架位于下部和上部之间。还描述了用于制造固定环的方法。

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