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Production manner of the integrated circuit package in package which was stacked and the integrated circuit package in package system which was stacked
Production manner of the integrated circuit package in package which was stacked and the integrated circuit package in package system which was stacked
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机译:堆叠式封装的集成电路封装和堆叠式封装系统的集成电路的生产方式
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摘要
A stacked integrated circuit package-in-package system is provided including forming a substrate with a top contact, mounting a first device having a first terminal over the substrate, stacking a second device having a second terminal over the first device in an offset configuration, connecting the first terminal to the top contact below the first terminal, and connecting the second terminal to the top contact below the second terminal.
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