APPARATUS FOR FABRICATING INLINE INTEGRATED CIRCUIT CHIP PACKAGE FOR PACKAGING DUAL-SIDED STACK MULTI CHIP AND METHOD FOR FABRICATING INTEGRATED CIRCUIT CHIP PACKAGE USING THE SAME TO REDUCE NUMBER OF MANUAL PROCESSES AND SIMPLIFY PROCESS

摘要

PURPOSE: An apparatus for fabricating an inline integrated circuit chip package for packaging a dual-sided stack multi chip is provided to reduce the number of manual processes and shorten an interval of TFT(turn around time) by simplifying a double-sided stack multi chip packaging process. CONSTITUTION: A loader part(110) supplies a leadframe from a magazine receiving the leadframe having the first surface and the second surface opposite to the first surface wherein the first surface of the leadframe faces upward. The first package fabricating apparatus(120) performs a process for mounting the first semiconductor chip on the first surface of the leadframe supplied from the loader part. The second package fabricating apparatus(130) performs a process for mounting the second semiconductor chip on the second surface of the leadframe. A buffer(140) includes an inversion unit(150) for inverting the leadframe to make the second surface face upward before the leadframe unloaded from the first package fabricating apparatus is supplied to the second package fabricating apparatus, installed between the first and second package fabricating apparatuses. An unloader part(180) makes the magazine filled with the leadframe unloaded from the second package fabricating apparatus to unload the magazine.