In-line apparatus for manufacturing integrated circuit chip package for facilitating dual-side stacked multi-chip packaging and method for constructing integrated circuit chip package using the same

摘要

Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.