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WAFER DICING BLADE AND WAFER DICING APPARATUS INCLUDING THE SAME
WAFER DICING BLADE AND WAFER DICING APPARATUS INCLUDING THE SAME
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机译:晶圆切割刀片和晶圆切割设备,包括相同的
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摘要
A wafer dicing blade includes a cutting part including a protrusion, the protrusion having a uniform region with a substantially uniform width, and a support covering at least one sidewall of the cutting part, the protrusion of the cutting part extending beyond an edge of the support.
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