Wafer Lens Array Dicing Apparatus Including Dicing Blade for Cutting Wafer Lens Array and Method Using the Same

摘要

Disclosed are a dicing blade for cutting a wafer lens array, and an apparatus and method for dicing a wafer lens array using the same. According to one embodiment of the present invention, in the dicing blade that is fixed to the spindle and rotates by the spindle and cuts the wafer lens array, the dicing blade has a through hole and is coupled to the spindle; A body portion having a surface and an outer circumferential surface, a side wall, a first cut portion formed so that the side wall and the outer circumferential surface face each other, and the first cut portions are arranged in an alternating form, the side wall is provided, and the side wall and the It provides a dicing blade, characterized in that it comprises a second cut portion formed to face the outer peripheral surface.