Chip-size-package semiconductor chip and manufacturing method

摘要

A method of manufacturing semiconductor chips includes preparing a semiconductor substrate having on its front side a plurality of chip forming areas; sticking a support to the front surface of the substrate via an adhesive sheet; forming through holes extending from the back surface of the substrate; forming a groove along each of boundaries between the chip forming areas, the groove extending from the back surface of the substrate through the adhesive sheet to the support to expose cross-sections of the adhesive sheet; forming an insulating film over the back surface so as to cover side walls of the through holes and the cross-sections of the adhesive sheet; and dicing the substrate along the grooves with the insulating film remaining.