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CHIP WITH A SLANTED CONDUCTIVE BUMP CAPABLE OF PREVENTING A SHORT CIRCUIT BETWEEN CONDUCTIVE BUMPS, AN ELECTRONIC PART INCLUDING THE CHIP, AND A MANUFACTURING METHOD THEREOF
CHIP WITH A SLANTED CONDUCTIVE BUMP CAPABLE OF PREVENTING A SHORT CIRCUIT BETWEEN CONDUCTIVE BUMPS, AN ELECTRONIC PART INCLUDING THE CHIP, AND A MANUFACTURING METHOD THEREOF
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机译:具有防止导电凸块之间短路的导电凸块的芯片,包含芯片的电子零件及其制造方法
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摘要
PURPOSE: A chip with a slanted conductive bump, an electronic part including the chip, and a manufacturing method thereof are provided to restrict excessive deformation of the conductive bump, thereby preventing conductive bump destruction.;CONSTITUTION: One or more pads(210) are arranged on the surface of a chip(200) including a conductive bump. A plurality of first slanted conductive bumps(220) is arranged on the upper surface of the pad. A plurality of second slanted conductive bumps(230) is arranged on the surface of the chip adjacent to the pad. The first and second slanted conductive bumps have a cylindrical structure slanted with a fixed angle(Θ). A polymer layer(240) fills the circumference of the first and second slanted conductive bumps.;COPYRIGHT KIPO 2012
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