CHIP COMPRISING CONDUCTIVE BUMP AND ITS FABRICATION METHOD AND AN ELECTRONIC APPLICATION HAVING THE SAME AND ITS FABRICATION METHOD, CAPABLE OF PREVENTING A CONDUCTIVE PUMP FROM BEING BROKEN DOWN BY LIMITING THE EXCESSIVE DEFORMATION OF A METAL PUMP

摘要

PURPOSE: A chip comprising conductive bump and its fabrication method and an electronic application having the same and its fabrication method are provided to reduce process costs by manufacturing a conductive pump through one time of lithography and a mechanical processing.;CONSTITUTION: In a chip comprising conductive bump and its fabrication method and an electronic application having the same and its fabrication method, a plurality of first conductive bumps(220) are formed on the top of a pad. A plurality of second conductive pumps(230) are formed on the surface of a chip adjacent to the pad. The first and second conductive pump is comprised of a metal bump(270), an outer polymer(280), and an inner polymer(240). The inner polymer is filled inside the metal pump. The outer polymer surrounds the external periphery of a metal pump.;COPYRIGHT KIPO 2011