METHOD FOR MANUFACTURING A CONDUCTIVE BUMP RECEIVING STRUCTURE WITH A HOLLOW PART, THE CONDUCTIVE BUMP RECEIVING STRUCTURE AND A METHOD FOR CONNECTING CHIPS USING THE SAME

摘要

PURPOSE: A method for manufacturing a conductive bump receiving structure with a hollow part, the conductive bump receiving structure, and a method for connecting chips using the same are provided to induce connection between the chips using a dot or line type conductive bump.;CONSTITUTION: A photoresist layer(110) is laminated on a substrate. The photoresist layer is patterned. The photoresist layer with a trench structure(111) is formed by a patterning process. A seed layer(120) is coated on the front side of the photoresist layer with the trench structure. The coated seed layer is electroplated.;COPYRIGHT KIPO 2013