MANUFACTURING METHOD OF A PLASMA PROCESSING APPARATUS AND A SEMICONDUCTOR DEVICE WHICH PLANS PRODUCTIVITY INCREASING BY IMPROVING YIELD

摘要

PURPOSE: The manufacturing method of a plasma processing apparatus and a semiconductor device are provided to prevent the generation of discharge between a semiconductor wafer and the base material of a placement table or neighboring structures.;CONSTITUTION: A placement table(2) is installed within a process chamber. The placement table comprises a base material(2a) consisting of a conductive metal. An upper electrode(6a) is arranged in order to face with a lower electrode. A lifter pin(210) is installed on the top of a support stand and supports a processed substrate(W). The lifter pin comprises pin main body part(211) and a lid part(212) having external diameter which is bigger than external diameter of the pin main body part.;COPYRIGHT KIPO 2012