首页> 外国专利> COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL

COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL

机译:铜合金箔,使用相同方法获得的柔性印刷线路板以及生产铜合金箔的方法

摘要

The zirconium content of the alloy composition of a copper alloy foil 10 of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil 10 includes copper matrix phases 30 and composite phases 20 composed of copper-zirconium compound phases 22 and copper phases 21. As shown in Fig. 1 , the copper matrix phases 30 and the composite phases 20 form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases 22 and the copper phases 21 in the composite phases 20 form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil 10 densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.
机译:本发明的铜合金箔10的合金组成中的锆含量为3.0〜7.0原子%,该铜合金箔10具有铜基质相30和由铜锆化合物相22和铜相构成的复合相20。如图21所示,铜基质相30和复合相20形成基质相复合相层状结构,并且在垂直于宽度方向的截面中,平行于轧制方向交替地排列。另外,如上所述,复合相20中的铜-锆化合物相22和铜相21形成复合相内层状结构,并且与轧制方向平行地交替排列,如上所见,相距为50nm或更小。横截面。该双层结构大概使铜合金箔10致密地分层以提供类似于多层增强复合材料的增强机理。

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