A newly developed nanoscale profile copper foil is introduced as ultra-low profile copper foil for PCBs fabricated using subtractive processes. Fine-line capability is demonstrated, and it seems 20-25um traces are possible using a subtractive process. This would contribute to a reduction in cost. Good adhesion is confirmed even though the surface is flat. Adhesion behavior was investigated through simulation. A localized realistic model and seg-mentalized parameter of prepreg are important to calculate the accumulated principal stress at the nanoscale level. The use of nanoscale profile copper foil is highly recommended for fine-line PCBs using a subtractive process.
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