The electronic equipment is becoming smaller in size and lighter in weight in recent years. Many manufacturers are introducing the build-up PWB techniques to meet the demand to downsize the printed wiring boards (PWBs). A series of resin coated copper foils (standard type, halogenated free type, high Tg type) have been developed to manufacture the build-up PWBs by the conventional lamination process. The insulation layer has no glass reinforcement so very small interstitial via holes can be formed by laser. In addition, its dielectric constant is very low. This paper describes the manufacturing technology of these materials and the test results on their reliability.
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