首页> 外文期刊>New Technology Japan >Factory Producing Electrodeposited Copper Foils for Printed Circuit Boards by Applying Traditional Arts and Introducing Advanced Technologies: Kyoto Factory of Fukuda Metal Foil & Powder Co., Ltd.
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Factory Producing Electrodeposited Copper Foils for Printed Circuit Boards by Applying Traditional Arts and Introducing Advanced Technologies: Kyoto Factory of Fukuda Metal Foil & Powder Co., Ltd.

机译:运用传统工艺并引进先进技术生产印制电路板电沉积铜箔的工厂:福田金属箔粉末有限公司京都工厂

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摘要

The Japanese electrodeposited copper foil manufacturing technology has taken the lead in the world's market by merit of its sophisticated technologies, but the pursuit by Southeast Asian countries with low selling prices as their selling points is intensive indeed, making a loss in Japan's share of the market unavoidable. Against this backdrop, the company has established a research department in its compounds and striving to develop foils which are increasingly thinner and stronger, also developing a new surface treatment technology. In addition, to cope with low-priced counterparts, the company is also striving to attain higher added values as by manufacturing electrodeposited copper foils for use by its portable telephone and high-tech departments.
机译:日本的电沉积铜箔制造技术凭借其先进的技术在世界市场上处于领先地位,但是东南亚国家以其低价卖价的确在紧追其路,这使日本失去了市场份额不可避免的。在此背景下,该公司在其复合材料中建立了研究部门,并致力于开发越来越薄和更坚固的箔,同时还开发了一种新的表面处理技术。此外,为了应对价格低廉的竞争对手,该公司还努力通过制造供便携式电话和高科技部门使用的电沉积铜箔来获得更高的附加值。

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