ELECTRODEPOSITED COPPER FOIL, ITS MANUFACTURING METHOD, SURFACE-TREATED ELECTRODEPOSITED COPPER FOIL USING THE ELECTRODEPOSITED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING THE SURFACE-TREATED ELECTRODEPOSITED COPPER FOIL

摘要

IT IS AN OBJECT OF THE PRESENT INVENTION TO PROVIDE AN ELECTRODEPOSITED COPPER FOIL WHICH HAS A LOWER PROFILE AND A HIGHER GLOSSINESS THAN LOW-PROFILE ELECTRODEPOSITED COPPER FOIL CONVENTIONALLY SUPPLIED IN MARKETS. FOR ACHIEVING THIS OBJECT, THE PRESENT INVENTION EMPLOYS AN ELECTRODEPOSITED COPPER FOIL WHICH HAS A SUPER LOW PROFILE, THE SURFACE ROUGHNESS (RZJIS) OF THE DEPOSIT SURFACE OF LESS THAN 1.0 µM, AND THE GLOSSINESS [GS (60°)] THEREOF OF NOT LESS THAN 400 IRRESPECTIVE TO ITS THICKNESS. THE PRESENT INVENTION ALSO PROVIDES A MANUFACTURING METHOD OF AN ELECTRODEPOSITED COPPER FOIL OBTAINED BY ELECTROLYZING USING A SULFURIC ACID BASE COPPER ELECTROLYTIC SOLUTION OBTAINED BY ADDING 3-MERCAPTO-1-PROPANESULFONIC ACID AND/OR BIS(3-SULFOPROPYL) DISULFIDE, A QUATERNARY AMMONIUM SALT POLYMER HAVING A CYCLIC STRUCTURE, AND CHLORINE.