Electrolytic copper foil, surface-treated electrodeposited copper foil obtained using the electrolytic copper foil, copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic copper foil which has a lower profile and a flatter surface with less waviness than a low-profile electrolytic copper foil that has been conventionally supplied to a market.;SOLUTION: The electrolytic copper foil is obtained through electrolysis in the cupric electrolyte solution; has such a surface in a deposition side as to present a surface roughness (Rzjis) of less than 1.0 m, a glossiness [Gs(60)] of 400 or higher, and a ratio ([TD glossiness]/[MD glossiness]) of the TD glossiness when measured in a width direction to the MD glossiness when measured in a flow direction in an amount of 0.9 to 1.1; and has such a surface in a glossy side as to present the surface roughness (Rzjis) of less than 2.0 m and the glossiness [Gs(60)] of 70 or higher.;COPYRIGHT: (C)2007,JPO&INPIT